free shipping NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing Soldering Welding Repair No Clean
Model : NC-559-ASM
Volume : 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection
Package included :
1 x NC-559-ASM Solder Flux Solder Paste
