Heatsink Viscous Plaster Thermal Conductive Adhesive Compound Glue For PC GPU IC
Heatsink Plaster Thermal Conductive Glue
Thermal properties, strong adhesion. Melting capacity: 0 (200degree celsius/ 24Hours) Evaporation: 0.001% (200 degree celsius/ 24Hours) Thermal conductivity: > 1.2W/m-K Thermal Impedance: <0.06 Clotting time: 3min (25 degree celsius) Strength of connected buildings: 25Kg Insulation coefficient: > 5.1 Dissipation coefficient: <0.005 Temperature resistance: 200 degree celsius Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels. Item includes 1x Heatsink Plaster 
